4860P-35G

4860P-35G is a Sn63/Pb37 solder paste, also known as Sn63 solder paste or 63 37 solder paste, is a no clean solder paste that is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies). Sn63/pb37 solder paste is designed for use in high-speed printing and is an ideal choice for SMT solder paste printers. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3mm.

• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B
• Non-corrosive
• Non-conductive residue
• Good wettability
• Type 3 (45-25µm)
• 35g (1.23oz) syringe